
PCB Cleaning Chemistry
KYZEN E5631 is a next-generation aqueous cleaner for SMT stencils and misprinted boards. Diluted below 25 % in DI water it removes raw solder paste, flux and uncured adhesive in spray-in-air stencil cleaners such as the EPS SC-740 and in ultrasonic tanks, at ambient temperature up to 49 °C, followed by a DI-water rinse and hot-air drying. Compatible with stencil materials and stencil-cleaner construction materials.
| Property | Value |
|---|---|
| Brand | KYZEN1 |
| Type | Aqueous cleaner for flux and uncured adhesive on stencils and misprinted boards2 |
| Application | Spray-in-air and ultrasonic stencil-cleaning processes2 |
| Concentration | Below 25 % in DI water2 |
| Process temperature | Ambient to 49 °C2 |
| Rinse / dry | DI water rinse recommended; hot-air dry2 |
| Boiling point | 104 °C2 |
| Flash point | None to boiling2 |
| VOC at 10 % | 87.4 g/L2 |
| Water solubility | Partial2 |
| Packaging | 5 L, 25 L and 200 L polyethylene containers (also 1, 5 and 55 US gal)2 |
| Shelf life | 5 years in sealed containers of 25 L or more; store at 5–50 °C2 |
| Safety | Non-hazardous, biodegradable; no CFCs or HAPs; favourable GHS ratings2 |
Pricing on request
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