Comparison guide
Reflow ovens come in two fundamental configurations: batch (front-loading, one board at a time) and inline (a continuous conveyor through physically separated heating zones). The right choice depends on your production volume, board mix, floor space, and budget.
| Factor | Batch reflow oven | Inline reflow oven |
|---|---|---|
| Production volume | 1-50 boards/day | 50-5,000+ boards/day |
| Price range (India) | Rs 30,000 - Rs 1,50,000 | Rs 1,10,000 - Rs 10,00,000+ |
| Floor space | Small (tabletop, ~0.5 m²) | Large (1.5-5 m² plus conveyor run) |
| Profile control | Simulated multi-zone (time-based) | True multi-zone (spatial) |
| Throughput | 5-15 min per board | Continuous, set by conveyor speed |
| Temperature uniformity | Moderate | Excellent |
| Best for | Prototyping, R&D, NPI | Production, medium-high volume |
| Specification | Why it matters |
|---|---|
| Number of zones | More zones mean finer profile control; 5+ zones recommended for lead-free |
| Max temperature | Must reach 260°C+ for lead-free solder (400°C gives good margin) |
| Conveyor speed range | A wider range gives more profile flexibility across board types |
| Board width capacity | Must fit your largest PCB with margin |
| Nitrogen capability | Reduces oxidation and improves wetting for lead-free processes |
A common upgrade path: start with a batch oven for prototyping and NPI, then add an inline oven as volume grows. The batch oven stays useful for profile development and rework even after inline production begins.